QWR Interactive Solutions · Engineering Reference

Design for
Manufacturing Guide

Hardware guidelines for partners, OEMs, and developers building with QWR. Covers electronics, mechanical enclosures, XR optics, and material specifications — from prototype to production.

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Rev 1.0
Version
02 Apr 2026
Last Updated
Active
Status
Owner QWR Engineering
Document type External Reference
Contact engineering@questionwhatsreal.com
Applies to Hardware Partners / OEMs Enterprise Customers Indie Developers / Makers Internal Team
PCB & Electronics

Layout rules, component clearances, signal integrity, and testability requirements. All PCBs must conform before fabrication. Deviations require written sign-off from QWR Engineering.

Board Specifications

ParameterMinimumRecommendedNotes
Min trace width0.1 mm0.15 mmSignal traces; power traces per IPC-2221
Min trace spacing0.1 mm0.15 mmIncrease for high-voltage rails (>50 V)
Min via drill0.2 mm0.3 mmMicro-vias require DFM review
Min annular ring0.125 mm0.15 mmAll drill classes
Board thickness0.6 mm1.0 mmXR form-factor targets: 0.8 mm
Copper weight (outer)1 oz1 oz2 oz for power stages
Copper weight (inner)0.5 oz1 oz
Edge clearance0.3 mm0.5 mmAll copper from board edge
Min solder mask opening0.1 mm+0.05 mm exp.LPI solder mask preferred

Component Placement

Critical

Keepout zones

Maintain a 3 mm component-free keepout on all board edges. Connectors are exempt only if deliberately edge-mounted.

Critical

Heatsink clearance

No components taller than 0.5 mm within 2 mm of any active heatsink or thermal pad footprint.

Recommended

SMD orientation uniformity

Align passive components in consistent orientations to optimise the reflow profile and reduce tombstoning risk.

Recommended

Decoupling placement

Place decoupling capacitors within 0.5 mm of IC power pins. Use a separate copper pour — not a shared power plane tap.

Advisory

Test point coverage

Expose all key power rails and I²C/SPI/UART buses via labelled test points. Minimum pad diameter: 1 mm.

Advisory

Fiducial markers

Include a minimum of 3 fiducials at board corners for SMT pick-and-place. 1 mm copper circle, 3 mm copper-free keepout.

Signal Integrity

High-speed differential pairs

USB 3.0, MIPI, and LVDS pairs must be length-matched within 2 mil. Route on the same layer. No vias mid-pair unless unavoidable; add compensating vias to both lines simultaneously.

Controlled impedance

Specify controlled impedance stackup in fab notes. 50 Ω single-ended, 90 Ω differential for USB. QWR standard 4-layer stackup: Signal / GND / Power / Signal.

Pre-Submission Checklist

  • Design Rule Check (DRC) passes with zero errors in KiCad / Altium
  • All component footprints verified against physical datasheet land patterns
  • Schematic reviewed for power sequencing and inrush protection
  • BOM exported with MPN, manufacturer, and approved alternatives flagged
  • Gerber, drill, and IPC-D-356 netlist packaged for fab
  • Assembly drawing includes polarity markers and reference designators
  • Pick-and-place centroid file generated and validated
Enclosure & Mechanical Design

Wall thickness, draft angles, assembly strategy, and fastener standards for injection-moulded and CNC-machined enclosures across QWR product lines.

Injection Moulding

ParameterValueNotes
Nominal wall thickness1.5 – 2.5 mmUniform wall preferred; avoid abrupt transitions
Min wall thickness0.8 mmStructural ribs only; consult material datasheet
Min draft angle2° recommended for textured surfaces
Rib thickness50–60% of wallPrevents sink marks on outer face
Boss outer diameter2× screw dia.Gusset to adjacent wall if height > 3× OD
Min inside radius0.5 mmAt wall junctions; hard corners cause stress concentration
Snap-fit deflection≤ 2%Of nominal beam length; verify with FEA for repeated cycles
Gate locationNon-cosmetic surfaceWeld lines must not cross structural features

CNC Machining (Aluminium)

Critical

Min feature size

Min pocket width 1.0 mm, min hole diameter 0.5 mm. Tolerances tighter than ±0.05 mm require QWR Engineering sign-off.

Critical

Chamfer vs fillet

Prefer chamfers on external edges; fillets on all internal corners. Min internal fillet R = 1/3 × cutter diameter in that pocket.

Recommended

Thread specification

M-series metric threads only. Specify fit class on drawing. M2 minimum for structural fastening in aluminium enclosures.

Advisory

Surface finish callout

Include Ra value on drawing. Bare aluminium default: Ra 1.6 µm. Hard-anodised: specify class 1 or class 2 per MIL-A-8625.

Assembly first-pass yield

Design for top-down assembly where possible. Every additional axis of assembly adds handling time and increases defect risk. QWR targets single-axis assembly for all sub-assemblies.

Fastener Standards

Approved fasteners

  • M2 / M2.5 / M3 socket head cap screws (ISO 4762)
  • M2 / M2.5 self-tapping for plastic bosses
  • Snap-fit for non-structural cosmetic panels
  • Heat-set inserts (M2+) for thermoplastic boss reuse

Not permitted

  • Imperial fasteners (UNC/UNF) — metric only
  • Adhesive-only structural joints
  • Countersunk screws in plastic under 2.5 mm wall
  • Custom fastener profiles without DFM review
XR Optics & Display Constraints

XR optics are the highest-precision component class in any QWR product. Tolerances are an order of magnitude tighter than standard mechanical parts. Any deviation must be validated through QWR's optical test bench before EVT build.

Display Panel Requirements

ParameterSpecificationStatus
Panel typeMicro-OLED / LCoS✓ Approved
Min PPI2000 PPI⚠ Verify per FOV target
Luminance (peak)≥ 5,000 nit✓ Required for outdoor AR
Colour gamut≥ 85% DCI-P3✓ Minimum
Refresh rate90 Hz minimum✓ 120 Hz preferred
Pixel response time≤ 2 ms✓ Required to prevent ghosting
Panel flatness≤ 10 µm bow⚠ Critical — waveguide coupling
Operating temperature0°C to +50°C✓ Consumer operating range

Waveguide Design Rules

No customer modification to waveguide geometry

Waveguide substrates are designed and validated entirely by QWR. Do not alter grating period, substrate index, or coupling angles. Mechanical drawings show keep-in zones only.

Critical

Incoupler position tolerance

In-coupling grating must be positioned within ±15 µm XY of nominal. Rotational tolerance: ±0.05°. Verified via autocollimation.

Critical

Waveguide-to-display gap

Air gap between display exit pupil and waveguide surface: 0.3 mm ± 0.05 mm. Contamination in this gap is a field-return trigger.

Recommended

Stray light baffling

Include light-absorbing baffles (Acktar or equivalent) between illumination path and detector. Reflectance < 0.5% at design wavelength.

Advisory

Waveguide handling

Handle only with clean-room gloves. No contact with grating surface. Ship in nitrogen-purged sealed bags to prevent particulate ingress.

Eye-Box & FOV Targets

ParameterTargetMinimum Acceptable
Horizontal FOV40°30°
Vertical FOV30°22°
Eye-box (horizontal)12 mm8 mm
Eye-box (vertical)8 mm6 mm
Eye relief18 mm14 mm
MTF @ 50 lp/mm≥ 0.30.2
Uniformity (centre vs edge)≥ 70%60%
Optical test deliverables required at EVT

All devices must pass QWR's optical qualification suite: MTF measurement, uniformity map, stray light scan, and eye-box cross-section. Test reports must be submitted with EVT build samples.

Materials & Tolerance Specifications

Material selection and tolerance callouts must be explicit on all engineering drawings submitted to QWR. Unspecified materials default to QWR's standard equivalents — this can cause schedule delays if design intent differs.

Approved Material Families

CategoryApproved MaterialsTypical UseNotes
Structural plasticPC, PC/ABS, PA66-GF30Main enclosures, structural framesUL94 V-0 required for all powered devices
Flexible / gasketTPU 85A–95A, SiliconeSeals, nose pads, cable strain reliefShore A specified on drawing
Optical plasticPMMA (optical grade), ZeonexLens elements, light pipes, diffusersTransmission ≥ 92% at design wavelength
Metal (structural)Al 6061-T6, Al 7075-T6, Ti Gr.5Machined frames, hinges, optic mounts7075 for high-load; Ti for premium/medical
Metal (cosmetic)Al 6063-T5, SS 316LExternal covers, decorative elementsAnodising spec required
PCB substrateFR-4, Rogers 4350BStandard PCB, RF/mmWave boardsRogers for >5 GHz designs
Adhesive3M 467MP, Loctite 603FPC bonding, lens seatingUV-cure only for optical bonding

Dimensional Tolerance Classes

TOLERANCE CLASS REFERENCE   ────────────────────────────────────────────

CLASS         LINEAR TOLERANCE      ANGULAR          TYPICAL APPLICATION
──────────────────────────────────────────────────────────────────────────
T1 — Coarse  ± 0.5  mm            ± 1.0°           Non-mating cosmetic features
T2 — Medium  ± 0.2  mm            ± 0.5°           Standard mating enclosure faces
T3 — Fine    ± 0.05 mm            ± 0.1°           Precision mechanical interfaces
T4 — Optic   ± 0.01 mm (10 µm)    ± 0.02°          Waveguide & lens seats
T5 — Ultra   ± 0.002 mm (2 µm)    ± 0.005°         Active optical alignment only
──────────────────────────────────────────────────────────────────────────
Default if unspecified: T2    |    Optic mounts: T4 minimum
GD&T callout required for T3 and above

All T3, T4, and T5 features must carry explicit GD&T callouts per ASME Y14.5-2018. Drawings without GD&T on precision features will be returned for revision.

Surface Finish Standards

FinishRa (µm)ProcessUse Case
Machined (as-cut)Ra 3.2CNC milling / turningNon-visible structural
Machined (fine)Ra 1.6CNC + finishing passMating faces, sealing surfaces
AnodisedRa 0.8 – 1.2Type II or IIIExternal aluminium; specify colour
PolishedRa 0.2 – 0.4Mechanical + buffMirror / chrome cosmetics
Optical surfaceRa < 0.01Diamond turning / lappingLens surfaces, waveguide substrate faces
Moulded textureSPI A1 – D3Tool texture per SPI standardCall out SPI grade on drawing

Compliance & Certification Requirements

Required — all hardware

  • RoHS 3 (EU 2015/863) compliance across full BOM
  • REACH SVHC declaration from material suppliers
  • UL94 V-0 or V-2 flame rating for enclosure plastics
  • Material Safety Data Sheets (MSDS/SDS) on file

Required — consumer products

  • CE marking (RED Directive for wireless devices)
  • FCC Part 15B / Part 15C (US market)
  • BIS certification (India market)
  • EN 62368-1 / IEC 62368-1 safety standard
Prohibited substances

Strictly prohibited in any QWR-manufactured product: hexavalent chromium, cadmium, lead (except exempted solder per RoHS Annex III), mercury, PBB, PBDE. Queries on exemptions must go to QWR Compliance before component selection is finalised.

Documentation Required at Design Freeze

  • Complete BOM with MPN, manufacturer, material grade, and RoHS status
  • Engineering drawings for all custom parts — GD&T per ASME Y14.5-2018
  • 3D STEP or Parasolid files for all mechanical components
  • Material certificates (CoC) from approved suppliers
  • Surface finish callouts on all external and mating faces
  • Tolerance analysis (worst-case or RSS) for all critical assemblies
  • Compliance declarations: RoHS, REACH, UL94 flame class
  • Optical prescription file (Zemax or CODE V) for all optical elements